Microelectronic Assembly

Banner 104.jpgTeledyne Labtech Microwave offers a comprehensive build-to-print microwave module and microwave components manufacturing service, which includes DFM support.  Our microwave MIC production facility is housed in a class 10,000 clean room and accommodates ceramic thin film circuit manufacture, laser drilling, laser welding, manual chip placement and semi-automatic wire bond assembly.  Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements. 

Manufacturing Capability

  • MIC Assembly
    • Semi-automatic chip and wire assembly
    • Wedge-wedge wirebonding
    • Ball-wedge wirebonding
    • Gold tapes for DC and RF connections
  • In-house RF machining and box build
  • In-house microwave PCB manufacture
  • In-house painting facilities



Teledyne Labtech Brochure

microwave module manufacturing

Home | Search | Terms and Conditions of Sale | Terms and Conditions of Purchase | Contact UK CH registered number: 03863642
Copyright © 2016 Teledyne Labtech, a division of Teledyne Ltd. All rights reserved.
Reg Office: Aviation House, The Lodge, Harmondsworth Lane, West Drayton, Middlesex, UB7 0LQ, UK