RF/Microwave Multilayer PCB

Multilayer Micro-section.jpgTeledyne Labtech has established considerable technical knowledge and manufacturing experience in the supply of complex microwave PTFE and Mixed Dielectric Multilayer PCB.  From simple multilayer structures through to complex metal-cored PCB, Teledyne Labtech can offer the complete solution.

Teledyne Labtech has a policy of continuous investment and now boasts a capability that can meet the most demanding RF/Microwave requirements.  Teledyne Labtech can offer blind and buried, plated through vias (THP), laser cut cavities, embedded resistors and connectors.

  • Mixed Dielectric Multilayer PCB
  • Embedded resistors connector pins and capacitors
  • Complex machined and laser cut structures
  • Metal-cored PCB
  • Blind and buried via hole technology


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