Post-Bonded Metalbacked PCB

From concept through to production, Teledyne Labtech has the capability to support the complete design cycle.  Our vast experience is used to advise and recommend solutions for a diverse range of products and processes.PCB_circuit_v1_200.jpg

  • Aluminium, Copper and Brass backing   
  • Double-sided and multi-layer bonding
  • Both conductive and non-conductive bond films 
  • Complex machined structures
  • Thermal Management Solutions
    • Silicon Aluminium
    • Copper/Invar/Copper
    • Copper/Molybdenum/Copper


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